Specifications
Insulation Resistance: 1,000MW min. at 500V DC
Dielectric Withstanding Voltage: 700V AC for 1 minute for 1.00mm pitch
500V AC for 1 minute for 0.80mm pitch
100V AC for 1 minute for 0.75mm pitch
Contact Resistance: 100mW max. at 10mA/20mV max.
Operating Temperature Range: –40°C to +150°C
Contact Force: 15g~35g per pin within contact traveldistance between0.2~0.5mm
Mating Cycles: 10,000 insertions
Materials and Finish
Housing: Polyethersulphone (PES), glass-filled and Polyetherimide(PEI),glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Features
V-shape contact structure to lower the damage of coplanarity of solder balls
Available in 3 pitch sizes and various depopulation versions, please contact Yamaichi for further available pin counts or custom sockets
Socket Side Views
Socket Side Views |