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测试座/插座封装分类 >> YAMAICHI-SBGA  PDF资料下载 |
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NP396 Series (Open Top) Shrink Ball Grid Array (1.27mm Pitch) | ||||||||||||||||||||||||||||||
| Specifications | Part Number (Details) | ||||||||||||||||||||||||||||||
Insulation Resistance:1,000MW min. at 100V DC Dielectric Withstanding Voltage:100V AC for 1 minute Contact Resistance:30mW max. at 10mA/20mV max. Operating Temperature Range:–55°C to +150°C –40°C to +170°C Contact Force:13g per pin approx. Operationg Force:3.2 Kg Mating Cycles:10,000 insetions |
 Features Open top type sockets for BGA packages íCoverless shrink version í2-point Tweezer Contact System |
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