Series Overview *QFP (Quad Flat Packages, Gullwing Leads)

SMT Devices

Series IC402 (Open Top) Quad Flat Package (QFP) with 2-Point Contact Type

0.5mm Pitch

Speci  cations Insulation Resistance:                    1,000MΩ min. at 500V DC, pitch 0.5

Part Number (Details)

1,000MΩ min. at 500V DC, pitch 0.65 Dielectric Withstanding Voltage:   100V AC for 1 minute, pitch 0.5 500V AC for 1 minute, pitch 0.65

IC402 Series No.

-  100

4   -  002     *

Contact Resistance:                       30mΩ max. at 10mA/20mV max. Operating Temperature Range:     –40°C to +150°C Mating Cycles:                               10,000 insertions min. Contact Force:                               20g to 45g per pin

No. of Contact Pins   Number of Sides with Contacts

Materials and Finish Housing:    Polyetherimide (PEI), glass-  lled Polyethersulphone (PES) glass-  lled Contacts:    Beryllium Copper (BeCu) Plating:      Gold over Nickel

Design Number   Positioning Pin N = Without Positioning Pin P = With Positioning Pin

Series IC234 (Open Top) Quad Flat Package (QFP) with Shoulder Contact Type                                                                                 0.4 to 0.8mm Pitch

Speci  cations

Part Number (Details)

Insulation Resistance:                    1,000MΩ min. at 100V DC pitch 0.4, 0.5 1,000MΩ min. at 500V DC pitch 0.65, 0.8 Dielectric Withstanding Voltage:   100V AC for 1 minute pitch 0.4, 0.5 500V AC for 1 minute pitch 0.65

IC234 Series No.

-  120

4   -  017     *

700V AC for 1 minute pitch 0.8 Contact Resistance:                       30mΩ max. at 10mA/20mV max. Operating Temperature Range:     –40°C to +150°C Contact Force:                               20g to 80g per pin Mating Cycles:                               10,000 insertions min.

No. of Contact Pins   Number of Sides with Contacts   Design Number

Materials and Finish Housing:    Polyetherimide (PEI), glass-  lled Polyethersulphone (PES) glass-  lled Contacts:    Beryllium Copper (BeCu) Plating:      Gold over Nickel

Positioning Pin N = Without Positioning Pin P = With Positioning Pin K = Protection Key ** ** Protection Key: Prevents IC from releasing during transportation

Series IC200 / IC201 / IC216 / IC217 / IC218 / IC248 (Open Top) Quad Flat Packages (QFP)

0.5 to 0.8mm Pitch

Speci  cations

Part Number (Details)

Insulation Resistance:                    1,000MΩ min. at 500V DC or 1,000MΩ min. at 100V DC Dielectric Withstanding Voltage:   100/500/700V AC for 1 minute Contact Resistance:                       30mΩ max. at 10mA/20mV max.

IC200 Series No.

-  128

4  -  001   *  - *

Operating Temperature Range:     –40°C to +170°C  and –40°C to +150°C Contact Force:                               20g to 80g per pin Mating Cycles:                               10,000 insertions min.

No. of Contact Pins   Number of Sides with Contacts

The information above is typical for this Series for individual speci  cations please contact Yamaichi

Design Number

Materials and Finish Housing:    Polyetherimide (PEI), glass-  lled Polyphenylenesul  de (PPS), glass-  lled Contacts:   Beryllium Copper (BeCu) Plating:     Gold over Nickel

Positioning Pin: N = Without Positioning Pin P  = With Positioning Pin   Protection Key** K = With Protection Key Unmarked = Without Protection Key

**Protection Key: Prevents IC from releasing during transportation

SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE   –   DIMENSIONS IN MILLIMETER

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