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PGA老化测试座 PGA SOCKET
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PGA (pin grid array) 陈列引脚封装。插装型封装之一,其底面的垂直引脚呈陈列状排列。封装基材基本上都采
用多层陶瓷基板。在未专门表示出材料名称的情况下,多数为陶瓷PGA,用于高速大规模逻辑LSI 电路。成本较高。引脚中心距通常为2.54mm,引脚数从64 到447 左右。
为了降低成本,封装基材可用玻璃环氧树脂印刷基板代替。也有64~256 引脚的塑料PGA。 另外,还有一种引脚中心距为1.27mm 的短引脚表面贴装型PGA(碰焊PGA)。
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PGA测试座 PGA老化座 PGA Socket |
3M Textool PGA Sockets
part #200-4660-14-1900
Lever actuated zero insertion force mechanism
Rugged 3-plate construction for durability and electrical reliability
Available with ush handle option for use with test probes and ease of board stacking
Available in 10 x 10 through 25 x 25 matrices
Contacts, handles, top-plate and cam plate are replaceable |
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
PGA测试座 PGA老化座 PGA Socket |
3M Textool PGA Kit Sockets
Available in 10 x 10 matrix through 25 x 25 matrix
Used when only a few test sockets are needed
Provides individual components ready for assembly
Open pattern top plate; load only those contacts needed for your specic device pin pattern |
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Part Number |
Matrix Size |
Description |
MFR. |
200-6310-9UN-1900 |
10 x 10 |
Socket Kit w/o Conta cts |
3M Textool |
200-6311-9UN-1900 |
11 x 11 |
3M Textool |
200-6313-9UN-1900 |
13 x 13 |
3M Textool |
200-6315-9UN-1900 |
15 x 15 |
3M Textool |
200-6317-9UN-1900 |
17 x 17 |
3M Textool |
200-6319-9UN-1900 |
19 x 19 |
3M Textool |
200-6321-9UN-1900 |
21 x 21 |
3M Textool |
200-6325-9UN-1900 |
25 x 25 |
3M Textool |
300-6300-CNA-0002B |
Each |
Contact - BeCu/Au Plated |
3M Textool |
200-4660-14-1900 |
Set of 10 |
Extra Hole Plugs |
3M Textool |
SPGA测试座 SPGA老化座 SPGASocket |
3M Textool Shrink PGA Sockets
Applicable package for 1.27 mm (.050") pitch PGA
Zero insertion force
Double mating contact
Lever actuation mechanism
Maximum grid 37 x 37 and lead count of 600 |
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IPGA测试座 IPGA老化座 IPGA Socket |
3M Textool Interstitial PGA Sockets
17 x 17 outer matrix with 16 x 16 inner staggered matrix holds up to 432 leads
Lever actuated zero insertion force mechanism
Rugged 3-plate construction for durability and electrical reliability
Accommodates two lead diameter variations
.25 - .40 mm (.010" - .016") and
.35 - .51 mm (.014" - .020") |
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PGA测试座 PGA老化座 PGA Socket |
WELLS-CTI 650/651 Series ZIP PGA Socket
Zero Insertion Force with normally closed contacts
650 Series has Left side actuation
651 Series has Right side actuation
High normal force Dual Beam contacts
Chamfered lead-in area for easy insertion of IC contacts
Normally closed balance beam contacts maintain constant pressure on device leads.
Designed for fully automatic loading and unloading of devices
Stress-free socket during burn-in |
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IPGA测试座 IPGA老化座 IPGA Socket |
WELLS-CTI 681 Series ZIF IPGA Socket
Zero Insertion Force with normally closed contacts
Horizontal and vertical detents allow positive handle locations
Chamfered lead-in area for easy insertion of IC contacts
Keyed hole plug available for device orientation
Heatsink option available with thermal transfer interface |
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PGA测试座 PGA老化座 PGA Socket |
WELLS-CTI 682 Series ZIF PGA Socket
Zero Insertion Force with normally closed contacts
Horizontal and vertical detents allow positive handle locations
Chamfered lead-in area for easy insertion of IC contacts
Keyed hole plug available for device orientation |
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PGA测试座 PGA老化座 PGA Socket |
WELLS-CTI 683 Series ZIF PGA Socket
Zero Insertion Force with normally closed contacts
Horizontal and vertical detents allow positive handle locations
Chamfered lead-in area for easy insertion of IC contacts
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Part Number |
Body Size |
Grid |
Row/Array |
Leads |
Pitch |
MFR. |
PGA-296(420)-1.78-01 |
49.53X49.53 |
37X37 |
Staggered |
296 |
1.78 |
ENPLAS |
PGA-296(420)-1.78-02 |
49.53X49.53 |
37X37 |
Staggered |
296 |
1.78 |
ENPLAS |
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