Sensata SOP 封装测试座/老化座SOP Test &Burn-in socket
Small Outline Package (SOP) Series
Chart of Small Outline Package (SOP) Series
| • |
Zero insertion force and self–alignment
of IC package for automatic loader/unloader |
| • |
High reliability in operation with
special contact design |
| • |
Open body construction for efficient heat radiation of IC package |
Specifications
Current Rating |
Max. 1 Amp |
Insulation
Resistance |
Min. 1,000 M ohm |
Dielectric Strength |
AC 700 V-RMS / 1 Min |
Initial Contact
Resistance |
Max. 30m ohm at DC 10mA |
Operating
Temperature |
-65°C to +150°C |
Durability |
Min. 10,000 Cycles |
|
Pin Availability
No. of Pos. |
Pitch mm |
Package Width mil |
8 |
1.27 |
173 |
10 |
1.27 |
224 |
16 |
1.27 |
320 |
24 |
0.65 |
236 |
28 |
0.55 |
8mm |
28 |
1.27 |
331 |
32 |
1.27 |
346 |
32 |
1.27 |
331 |
28 |
1.27 |
346 |
32 |
1.27 |
421 |
32 |
1.27 |
445 |
32 |
1.27 |
450 |
36 |
0.80 |
331 |
No. of Pos. |
Pitch mm |
Package Width mil |
40 |
0.80 |
331 |
40 |
1.27 |
421 |
40 |
1.27 |
445 |
40 |
1.27 |
449 |
42 |
0.80 |
331 |
44 |
1.27 |
496 |
44 |
1.27 |
512 |
44 |
1.27 |
520 |
44 |
1.27 |
524 |
64 |
0.80 |
445 |
64 |
0.80 |
454 |
64 |
0.80 |
472 |
70 |
0.50 |
390 |
|
NUMBERING
1 = |
Series Name |
2 = |
Pin Numbers |
3 = |
Variation |
Contact Finish: Gold Plating
- 10µ" |
Body Material: PEI Glass
Filled |
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