IC测试座/IC插座 |
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IC插座|测试座
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IC插座|测试座
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IC测试座/IC插座/老化座 (IC Test and Burn-In Sockets)
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得技通电子专业代理及经销各式 IC 测试座, IC 测试夹具, 老化测试座, 电源模块测试座, 品牌包括: ENPLAS, YAMAICHI, WELLS-CTI, E-TEC, 3M TEXTOOL, TI, PLASTRONICS, ADVANCED INTERCONNECTIONS 球型出脚 BGA 测试插座, MERITEC 贴片 SOP 测试插座等. 测试座封装含概: BGA, CSP, PGA, QFN, MLF, LGA, QFP, TSOP, SOP, PLCC, SOJ, TO 等, 并且可以根据客户需求定制 BGA/QFN 测试座. 无论您是设计, 测试, 烧录, 还是老化, 生产, 必有一款满足您的要求.
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BGA Socket / BGA测试座/老化座/烧写座/IC插座 |
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得技通电子提供最全的BGA 测试/老化插座产品, 依托欧洲领先的 BGA 测试产品生产工艺, 为客户提供优质的 BGA/CSP/LGA 测试插座产品,并可根据客户芯片的规格,提供定制化的服务。 BGA 测试插座分球形出脚(SMT) 和针形出脚两种设计.球形出脚的 BGA 插座系统主要适用于芯片的测试及开发等. 该插座系统的特点是不用在PCB 板上开孔, BGA 插座的焊接方法和BGA 芯片的焊接方法完全一样. 同时如果在客户的目标板上BGA
Pad 旁边如果已经存在一些贴片器件而影响到BGA 插座的安装,我们亦提供BGA 插座的升高设计以便满足客户的实际要求. 部分BGA插座货期更短至2-3周. 并可根据客户的BGA 器件出脚,定制合适的BGA 插座(Available
for any chip size and grid pattern) .
老化插座的工作温度一般为:-55°C~150 °C
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IC Test and Burn-In Socket - DeJiTong Electronic |
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BGA Surface Mount Socket(表贴,球形出脚)
Solderless Compression Type(无需焊接的BGA测试插座) |
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- Any package style: ceramic & plastic BGA, CSP, LGA, CGA, PSGA, MLF/QFN, QFP, SOIC and other standard packages, custom packages or bare die
- Same footprint as BGA device.
- -1dB bandwidth: >14GHz for compression style; 3GHz for SMD style
- Inductance: less than 2nH
- Hundreds of footprints available from 1.5mm down to 0.50mm pitch.
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IC Test and Burn-In Socket - DeJiTong Electronic
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QFN Socket/MLF socket |
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- Available in .40, .50, .65, .80 and 1.00 mm pitches
- Custom pitches down to .30 mm
- Lidded and Open Top Sockets for 3 mm - 10 mm packages
- Hundreds of footprints available from 1.5mm down to 0.75mm pitch.
- Lidded Sockets for 10 - 16 mm packages
- Center ground pin standard for all sockets
- Optional copper heat slug available for high wattage devices
- Sockets for over 80 different JEDEC standard footprints
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IC Test and Burn-In Socket - DeJiTong Electronic |
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PGA Socket / PGA测试老化测试座 |
得技通电子提供最全的PGA测试/老化插座,产品分为2.54mm及1.27mm两重规格, 品牌包括: 3M™ Textool™
, WELLS-CTI, Advanced Interconnections 及YAMAICHI等.
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IC
Test and Burn-In Socket - DeJiTong Electronic |
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QFP Socket / QFP老化测试座 |
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- Pin counts 32 to 304
- Pitch sizes 0.4, 0.5, 0.635, 0.65, 0.8 and 1.0mm
- High reliability, durability and temperature
range
- Custom made also available for high pin
count and fine
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IC
Test and Burn-In Socket - DeJiTong Electronic |
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SOP
Socket / SOP老化测试座 |
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Pin Count: 16
to 88
Pitch: 0.5
to 1.27
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IC
Test and Burn-In Socket - DeJiTong Electronic |
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TSOP
Socket / TSOP老化测试座 |
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IC
Test and Burn-In Socket - DeJiTong Electronic |
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SOP
Surface Mount Socket |
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980020-48-01, 980020-48-02
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IC
Test and Burn-In Socket - DeJiTong Electronic |
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DIP
Socket / DIP老化座 |
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IC
Test and Burn-In Socket - DeJiTong Electronic |
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SOJ
Socket / SOJ老化测试座 |
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IC
Test and Burn-In Socket - DeJiTong Electronic |
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PLCC
Socket / PLCC老化测试座 |
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IC
Test and Burn-In Socket - DeJiTong Electronic |
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SOT
Socket/晶体管测试座/电源模块测试座 |
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更多... |
IC
Test and Burn-In Socket - DeJiTong Electronic |
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