 |
|
||||||||
|
|||||||||
Sensata 产品 |
||||||||||||||||||||||||||||||
|
||||||||||||||||||||||||||||||
 返回首页 |
Sensata BGA 封装测试座/老化座BGA Test &Burn-in socket
Ball Grid Array (BGA) Series
| • | Open
top, zero insertion force suitable for automated
load/un–load |
| • | Reliable
pinching action contact minimizes solder ball damage |
| • | Small
socket outline to maximize burn–in board density and
process through–put |
| • | Low
actuation force |
With
their tight pitch and delicate solder balls, testing
micro BGA packages presents a complex design
challenge. Texas Instruments (TI) has developed a
contact design that minimizes solder ball damage and
boosts yield.
This approach employs a "pinch" or dual–beam style contact that interfaces the sides of each solder ball at multiple points. Excessive disruption of the package solder ball geometry, on the bottom surface, can lead to assembly and reliability problems farther down the line. By interfacing the non critical sides of each solder ball and incorporating a superior contact design, the socket ensures electrical continuity, minimizes ball deformation, and eliminates potential manufacturing and reliability problems in the end package.
Since TI's burn–in test is cost–effective and available in high volume, manufacturers no longer have to rely on random testing to ensure quality. This non destructive test allows all Micro BGA packages to be tested.
Micro BGA is one of the most dynamic chip scale concepts to date. Its potential is particularly important in the flash memory market, where the demand for increasingly small form–factor packages makes the incumbent TSOP packages prohibitive.
This approach employs a "pinch" or dual–beam style contact that interfaces the sides of each solder ball at multiple points. Excessive disruption of the package solder ball geometry, on the bottom surface, can lead to assembly and reliability problems farther down the line. By interfacing the non critical sides of each solder ball and incorporating a superior contact design, the socket ensures electrical continuity, minimizes ball deformation, and eliminates potential manufacturing and reliability problems in the end package.
Since TI's burn–in test is cost–effective and available in high volume, manufacturers no longer have to rely on random testing to ensure quality. This non destructive test allows all Micro BGA packages to be tested.
Micro BGA is one of the most dynamic chip scale concepts to date. Its potential is particularly important in the flash memory market, where the demand for increasingly small form–factor packages makes the incumbent TSOP packages prohibitive.
Design Features
| • | Open top
auto–load cover actuated socket |
||||||||
| • | Mechanical contacts touch each solder ball
individually and independently |
||||||||
| • | Contact
protrusions pierce oxide on solder ball and give
reliable contact |
||||||||
| • | Contacts
touch the upper side of the solder balls to minimize
ball damage |
||||||||
| • | Once the
IC package is properly seated in the socket, latches
clamp the IC package in position to prevent movement
caused by vibration
Spec Overview
|
Specifications for BGA Packages
Pin Count |
IC Package |
Pitch |
IC Ball |
Grid Size |
||
Width |
Length |
Diameter |
Height |
|||
48 |
10.00 |
12.00 |
1.00 |
0.45 |
0.3 |
6*8 |
119 |
22.00 |
14.00 |
1.27 |
0.75 |
0.6 |
17*7 |
119 |
22.00 |
14.00 |
1.27 |
0.78 |
0.6 |
17*7 |
153 |
22.00 |
14.00 |
1.27 |
0.78 |
0.6 |
17*9 |
255 |
26.90 |
26.90 |
1.27 |
0.75 |
0.6 |
20*20 |
256 |
27.00 |
27.00 |
1.27 |
0.70 |
0.6 |
20*20 |
256 |
27.00 |
27.00 |
1.27 |
0.76 |
0.6 |
20*20 |
292 |
27.00 |
27.00 |
1.27 |
0.76 |
0.6 |
20*20 |
304 |
31.00 |
31.00 |
1.27 |
0.75 |
0.6 |
23*23 |
329 |
31.00 |
31.00 |
1.27 |
0.78 |
0.6 |
23*23 |
352 |
35.00 |
35.00 |
1.27 |
0.75 |
0.6 |
26*26 |
352 |
35.00 |
35.00 |
1.27 |
0.75 |
0.75 |
26*26 |
384 |
27.00 |
27.00 |
1.27 |
0.75 |
0.6 |
20*20 |
384 |
37.50 |
37.50 |
1.27 |
0.75 |
0.6 |
28*28 |
385 |
31.00 |
31.00 |
1.27 |
0.75 |
0.6 |
26*23 |
388 |
35.00 |
35.00 |
1.27 |
0.78 |
0.6 |
26*26 |
456 |
35.00 |
35.00 |
1.27 |
0.75 |
0.6 |
26*26 |
477 |
41.00 |
41.00 |
1.27 |
0.75 |
0.6 |
31*31 |
480 |
35.00 |
35.00 |
1.27 |
0.75 |
0.6 |
26*26 |
492 |
35.00 |
35.00 |
1.27 |
0.75 |
0.6 |
26*26 |
516 |
35.00 |
35.00 |
1.27 |
0.75 |
0.6 |
26*26 |
648 |
35.00 |
35.00 |
1.00 |
0.60 |
0.5 |
33*33 |
784 |
37.50 |
37.50 |
1.27 |
0.76 |
0.6 |
28*28 |
836 |
33.00 |
33.00 |
1.00 |
0.60 |
0.5 |
31*31 |
Pin Count |
Width |
Length |
Pitch
|
Diameter |
Height |
Grid
|
IC Package
|
IC Ball
|
|||||