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NP284 Series Chip Scale Package (CSP, 0.50mm Pitch)

Specifications

Part Number (Details)
Insulation Resistance:1,000MΩ min. at 100V DC
Dielectric Withstanding Voltage:100V AC for 1 minute
Contact Resistance:100mΩ max. at 10mA/20mV max.
Operating Temperature Range:–40°C to +150°C / -55°C to +150°C
Contact Force:15g per pin approx.
Mating Cycles:10,000 insertions minimun
csp
Materials and Finish

Housing: Polyetherimide (PEI), glass-filled
Polyetherssulphone (PES), glass-filled
Contacts: Beryllium Copper (BeCu)

Features

cspcsp

Open top type socket for CSP packages with 0.50mm pitch
Self contacting structure without upper pressing force (ZIF)
Fan-out?Terminal type, designed to reduce ball damage
Outline Base Socket Dimensionscsp

Matching IC Dimensions

Recommended PC Board Layout

csp csp
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